Recent Honors

Group Leader, 1 of 15 Phase-I Winners, SRC Copper Design Challenge

Entry:  Monolithic Copper Integrated Circuitry supporting Multi-Layer Micro-Electro-Mechanical Systems
SRC anouncement from Yahoo
Contest Sponsored by SRC, Novellus, UMC and SpeedFam-IPEC.
Electronic Packaging Fellow
Sponsored by Motorola and The Components, Hybrids and Manufacturing Technology Group of The Institute of Electrical and Electronic Engineers (IEEE/CPMT). 1995.

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