Group Leader, 1 of 15 Phase-I Winners, SRC Copper Design Challenge
Entry: Monolithic Copper Integrated Circuitry supporting Multi-Layer Micro-Electro-Mechanical Systems
SRC anouncement from YahooElectronic Packaging Fellow
Contest Sponsored by SRC, Novellus, UMC and SpeedFam-IPEC.
Sponsored by Motorola and The Components, Hybrids and Manufacturing Technology Group of The Institute of Electrical and Electronic Engineers (IEEE/CPMT). 1995.